Microelectronic and Photonic Packaging Materials Group
- W. Lin, O. Hildreth, and C. P. Wong. “Carbon Nanotubes as Thermal Interface Materials
for Electronic and Photonic Packaging”, Smart system integration and reliability,
in press.
- C. P. Wong, Y. Li, D. Lu, "Electrically Conductive Adhesives", Springer, (2009).
- C. P. Wong, K. Moon and Y. Li, Ed. “Nano-Bio- Electronic, Photonic and MEMS Packaging,”
Springer (2009).
- C. P. Wong and K. Moon, "Nano Materials for Microelectronic and Bio Packaging",
Chapter1, in “Nano-Bio- Electronic, Photonic and MEMS Packaging”, C. P. Wong, K.
Moon and Y. Li, Ed., Springer (2009).
- Y. Li, K. Moon and C. P. Wong, “Nano Conductive Materials For Packaging”, Chapter
2, in “Nano-Bio- Electronic, Photonic and MEMS Packaging”, C. P. Wong, K. Moon and
Y. Li, Ed., Springer (2009).
- H. Jiang, K. Moon and C. P. Wong, “Nano Lead-free Solder Pastes for Low Processing
Temperature Interconnect Applications in Microelectronic Packaging”, Chapter 8,
in “Nano-Bio- Electronic, Photonic and MEMS Packaging”, C. P. Wong, K. Moon and
Y. Li, Ed., Springer (2009).
- W. Lin and C. P. Wong, “Applications of Carbon Nano-materials as Electrical Interconnects
and Thermal Interface Materials”, Chapter 17, in “Nano-Bio- Electronic, Photonic
and MEMS Packaging”, C. P. Wong, K. Moon and Y. Li, Ed., Springer (2009).
- Y. Xiu, Y. Liu, and C. P. Wong, “Two Scale Roughness, Self-cleaning, and Low
Reflectivity Silicon Surface for Solar Cell Applications”, in “Functional Polymer
Nanocomposites for Energy Storage and Conversion”, ACS publication, in press.
- D. Lu and C.P. Wong, Ed., “Materials for Advanced Packaging”, Springer (2008).
- Z. Q. Zhang and C. P. Wong, “Flip-Chip Underfill: Materials, Process and Reliability”,
Chapter 9, in “Materials for Advanced Packaging”, D. Lu and C.P. Wong, Ed., p. 307-338,
Springer (2008).
- D. Q. Lu and C. P. Wong, “Electrically Conductive Adhesives (ECAs)”, Chapter
11, in “Materials for Advanced Packaging”, D. Lu and C.P. Wong, Ed., p. 365-406,
Springer (2008).
- D. W. Lee, L. L. Li, S. X. Wang, J. X. Lu, C. P. Wong, S.K. Bhattacharya and
J. Papapolymerou, “Embedded Passives”, Chapter 14, in “Materials for Advanced Packaging”,
D. Lu and C.P. Wong, Ed., p. 459-502, Springer (2008).
- X. D. Wang, Z. L. Wang, H. J. Jiang, L. Zhu, C.P. Wong and J.E. Morris, “Nanomaterials
and Nanopackaging”, Chapter 15, in “Nanopackaging, Nanotechnologies and Electronics
Packaging”, J. E. Morris, Ed., p. 503-546, Springer (2008).
- J. X. Lu and C. P. Wong, “Nanoparticle-Based High-k Dielectric Composites: Opportunities
and Challenges”, Chapter 7, in “Nanopackaging”, J. E. Morris, Ed., p. 121-138, Springer
(2008).
- D. Q. Lu, Y. Li and C. P. Wong, “Nanoconductive Adhesives”, Chapter 10, in “Nanopackaging”,
J. E. Morris, Ed., p. 189-208, Springer (2008).
- Y. Li, M. J. Yim, K. Moon and C. P. Wong, “Electrically Conductive Adhesives”,
Chapter 11, in “Smart Materials”, M. Schwartz, Ed., p. 11-12 to 24, CRC Press (2008).
- Z. Q. Zhang and C. P. Wong, “Flip-chip Underfill: Materials, Process, and Reliability”,
Chapter 15, in “Smart Materials”, M. Schwartz, Ed., p. 15-1 to18, CRC Press (2008).
- L. B. Zhu, D. W. Hess and C. P. Wong, “Carbon Nanotube Electrical and Thermal
Properties and Applications for Interconnects”, Chapter 12, in “Integrated Interconnect
Technology for 3D Nanoelectronic Systems”, M. S. Bakir and J. D. Meindl, Ed., p.359-388,
Article House (2008).
- M. J. Yim, Y. Li, K. S. Moon, K. W. Paik, and C. P. Wong, “Review of Recent
Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic
Packaging”, Part 1, in “Electrically Conductive Adhesives”, R. Gomatam, and K. L.
Mittal, Ed., p. 79-116, VSP (2008).
- D. D. Lu and C. P. Wong, “Recent Advances in Developing High Performance Isotropic
Conductive Adhesives”, Part 1, in “Electrically Conductive Adhesives”, R. Gomatam,
and K. L. Mittal, Ed., p. 117-134, VSP (2008).
- D. D. Lu, Y. G. Li and C. P. Wong, “Recent Advances in Nano-conductive Adhesives”,
Part 1, in “Electrically Conductive Adhesives”, R. Gomatam, and K. L. Mittal, Ed.,
p. 135-154, VSP (2008).