Microelectronic and Photonic Packaging Materials Group

Our ambition is to explore the novel materials to solve the engineering problems in electronic .


- Welcome the new visiting scholars: Dr. Song Li, Dr. Hongxu Li, Maogang Gong and Uraiwan Pongsa!
- Welcome Dr. daniela staiculescu join our group!

Selected recent publications

  • O. Hildreth, W. Lin, and C. P. Wong. “Use of Metal-assisted Chemical Etching of Silicon to Fabricate 3D Nanostructures: Effect of Catalyst Shape nad Etchant Composition on Etching Direction”. ACS Nano
  • W. Lin and C. P. Wong, “Comment on “The Effect of Stress Transfer within Double-Walled Carbon Nanotubes upon Their Ability to Reinforce Composites”, Advanced Matierals
  • W. Lin, R. W. Zhang, K. S. Moon, and C. P. Wong,“Molecular Phonon Couplers at Carbon Nanotube/Substrate Interface to Enhance Interfacial Thermal Transport”, Carbon
  • R. W. Zhang, Y. Li, J. Yim, K. S. Moon, D. Q. Lu, and C. P. Wong, “Enhanced Electrical Properties of Anisotropic Conductive Adhesive with π-Conjugated Self-Assembled Molecular Wire Junctions”, IEEE Transactions and Packaging Technologies, Vol. 32, No. 3, p. 677-683 (2009)